US Patent Issued to ADVANCED MICRO DEVICES on Aug. 4 for "Three-dimensional semiconductor package having a stacked passive device" (California, Texas Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,058, issued on Aug. 4, was assigned to ADVANCED MICRO DEVICES INC. (Santa Clara, Calif.).

"Three-dimensional semiconductor package having a stacked passive device" was invented by Rahul Agarwal (Santa Clara, Calif.) and Raja Swaminathan (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional semiconductor package assembly includes a die. The die includes a plurality of through silicon vias (TSVs). The TSVs includes a first TSV and a second TSV. The first TSV supplies power from an active surface of the die to a back surface of the die. The assembly also includes a passive device coupled to the back surface of the die such th...