US Patent Issued to Advanced Micro Devices, ATI Technologies on March 31 for "Fused bounding volume hierarchy for multiple levels of detail" (Canadian, Japanese, American Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,592,035, issued on March 31, was assigned to Advanced Micro Devices Inc (Santa Clara, Calif.) and ATI Technologies ULC (Markham, Canada).

"Fused bounding volume hierarchy for multiple levels of detail" was invented by Paritosh Vijay Kulkarni (Markham, Canada), Ikeda Sho (Yokohama, Japan) and Takahiro Harada (Roseville, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A fused bounding volume hierarchy, which is a combination of a base bounding volume hierarchy and one or more non-base bounding volume hierarchies, is generated. For each non-base bounding volume hierarchy, multiple subtrees in the non-base bounding volume hierarchy that include less ...