ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,723,169, issued on Sept. 1, was assigned to Advanced Echem Materials Co. Ltd. (Taoyuan, Taiwan).

"Photosensitive resin composition, cured product and manufacturing method thereof, light conversion layer and light emitting device" was invented by Chun-Kuan Tai (Taoyuan, Taiwan), Ya-Qian Chen (Taoyuan, Taiwan) and Yu-Chun Chen (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A photosensitive resin composition, a cured product and a manufacturing method thereof, a light conversion layer and a light emitting device are provided. The photosensitive resin composition includes a resin (A), an ethylenically unsaturated monomer (B), a photopolymer...