US Patent Issued to Adeia Semiconductor Technologies on Feb. 24 for "Structures for low temperature bonding using nanoparticles" (California Inventor)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,086, issued on Feb. 24, was assigned to Adeia Semiconductor Technologies LLC (San Jose, Calif.).

"Structures for low temperature bonding using nanoparticles" was invented by Cyprian Emeka Uzoh (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of making an assembly can include juxtaposing a top surface of a first electrically conductive element at a first surface of a first substrate with a top surface of a second electrically conductive element at a major surface of a second substrate. One of: the top surface of the first conductive element can be recessed below the first surface, or the top surface of the second conductive e...