US Patent Issued to Adeia Semiconductor Technologies on Feb. 17 for "Wire bonding method and apparatus for electromagnetic interference shielding" (California Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,659, issued on Feb. 17, was assigned to Adeia Semiconductor Technologies LLC (San Jose, Calif.).

"Wire bonding method and apparatus for electromagnetic interference shielding" was invented by Shaowu Huang (Sunnyvale, Calif.) and Javier A. Delacruz (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Apparatuses relating generally to a microelectronic package having protection from electromagnetic interference are disclosed. In an apparatus thereof, a platform has an upper surface and a lower surface opposite the upper surface and has a ground plane. A microelectronic device is coupled to the upper surface of the platform. Wire bond wires...