US Patent Issued to Adeia Semiconductor Technologies on Aug. 18 for "Dielets on flexible and stretchable packaging for microelectronics" (California Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,943, issued on Aug. 18, was assigned to Adeia Semiconductor Technologies LLC (San Jose, Calif.).

"Dielets on flexible and stretchable packaging for microelectronics" was invented by Shaowu Huang (Sunnyvale, Calif.) and Javier A. Delacruz (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Dielets on flexible and stretchable packaging for microelectronics are provided. Configurations of flexible, stretchable, and twistable microelectronic packages are achieved by rendering chip layouts, including processors and memories, in distributed collections of dielets implemented on flexible and/or stretchable media. High-density communication bet...