US Patent Issued to Adeia Semiconductor Bonding Technologies on Sept. 29 for "Selective alteration of interconnect pads for direct bonding" (North Carolina, California Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,313, issued on Sept. 29, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Selective alteration of interconnect pads for direct bonding" was invented by Gaius Gillman Fountain Jr. (Youngsville, N.C.) and Javier A. DeLaCruz (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonded structure and a method of forming such a bonded structure are disclosed. The bonded structure can include a first element and a second element. The first element has a first bonding surface including a first nonconductive material and a plurality of first contact pads. The first contact pads are electrically connected to one...