US Patent Issued to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES on Sept. 2 for "Post CMP processing for hybrid bonding" (North Carolina, California Inventors)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,406,959, issued on Sept. 2, was assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (San Jose, Calif.).

"Post CMP processing for hybrid bonding" was invented by Gaius Gillman Fountain Jr. (Youngsville, N.C.), Guilian Gao (San Jose, Calif.) and Chandrasekhar Mandalapu (Morrisville, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Devices and techniques include process steps for forming openings through stacked and bonded structures. The openings are formed by pre-etching through one or more layers of prepared dies after planarization of the bonding layer (by chemical-mechanical polishing (CMP) or the like) and prior to bonding. For instance, the...