US Patent Issued to Adeia Semiconductor Bonding Technologies on Sept. 1 for "Multi-metal contact structure in microelectronic assembly" (California Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,514, issued on Sept. 1, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Multi-metal contact structure in microelectronic assembly" was invented by Rajesh Katkar (Milpitas, Calif.) and Cyprian Emeka Uzoh (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A first conductive material having a first hardness is disposed within a recess or opening of a microelectronic component, in a first preselected pattern, and forms a first portion of an interconnect structure. A second conductive material having a second hardness different from the first hardness is disposed within the recess or opening in a second pr...