ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,806, issued on Oct. 6, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).
"Rapid thermal processing for direct bonding" was invented by Dominik Suwito (San Jose, Calif.), Thomas Workman (San Jose, Calif.), Rajesh Katkar (Milpitas, Calif.) and Laura Wills Mirkarimi (Sunol, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Bonded structures and methods of direct hybrid bonding are disclosed. Non-conductive regions of two elements, such as dies or wafers, are first bonded together to form a bonded structure. Aligned conductive regions of the bonded structure, such as metal pads or traces, are then annealed to expand br...