US Patent Issued to Adeia Semiconductor Bonding Technologies on Nov. 3 for "Bonded structure with interconnect structure" (California Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,812, issued on Nov. 3, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Bonded structure with interconnect structure" was invented by Belgacem Haba (Saratoga, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonded structure is disclosed. The bonded structure can include an interconnect structure that has a first side and a second side opposite the first side. The bonded structure can also include a first die that is mounted to the first side of the interconnect structure. The first die can be directly bonded to the interconnect structure without an intervening adhesive. The bonded structure can also include a...