US Patent Issued to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES on June 23 for "Direct bonding on package substrates" (California Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,031, issued on June 23, was assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (San Jose, Calif.).

"Direct bonding on package substrates" was invented by Belgacem Haba (Saratoga, Calif.), Rajesh Katkar (Milpitas, Calif.), Guilian Gao (San Jose, Calif.) and Cyprian Emeka Uzoh (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonded structure with a package substrate comprising an inorganic, insulating first bonding layer and first conductive features at a surface thereof and an electronic component comprising an inorganic, insulating second bonding layer and second conductive features at a surface thereof wherein the first bon...