US Patent Issued to Adeia Semiconductor Bonding Technologies on Feb. 24 for "Bonded structures without intervening adhesive" (California Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,084, issued on Feb. 24, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).

"Bonded structures without intervening adhesive" was invented by Belgacem Haba (Saratoga, Calif.), Rajesh Katkar (Milpitas, Calif.), Ilyas Mohammed (Santa Clara, Calif.) and Javier A. DeLaCruz (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonded structure can include a first reconstituted element comprising a first element and having a first side comprising a first bonding surface and a second side opposite the first side. The first reconstituted element can comprise a first protective material disposed about a first sidewal...