ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,799, issued on Feb. 10, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).
"Direct bonding methods and structures" was invented by Cyprian Emeka Uzoh (San Jose, Calif.) and Thomas Workman (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are methods for direct bonding. In some embodiments, a direct bonding method comprises preparing a first bonding surface of a first element for direct bonding to a second bonding surface of a second element; and after the preparing, providing a protective layer over the prepared first bonding surface of the first element, the protective layer having a th...