US Patent Issued to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES on Aug. 26 for "Stacked devices and methods of fabrication" (North Carolina, California Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,401,011, issued on Aug. 26, was assigned to ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (San Jose, Calif.).

"Stacked devices and methods of fabrication" was invented by Paul M. Enquist (Cary, N.C.) and Belgacem Haba (Saratoga, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Stacked devices and methods of fabrication are provided. Die-to-wafer (D2W) direct-bonding techniques join layers of dies of various physical sizes, form factors, and foundry nodes to a semiconductor wafer, to interposers, or to boards and panels, allowing mixing and matching of variegated dies in the fabrication of 3D stacked devices during wafer level packaging (WLP). Moldi...