ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,942, issued on Aug. 18, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.).
"Chiplet-to-chiplet protocol switch" was invented by Belgacem Haba (Saratoga, Calif.), Rajesh Katkar (Milpitas, Calif.) and Abul Nuruzzaman (Saratoga, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonded structure is disclosed. The bonded structure can include a carrier. The bonded structure can include a first die having a first communications circuitry to format a communication signal according to a first communication protocol and to transmit the communication signal. The bonded structure can also include a protocol switch die havin...