ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,440, issued on Jan. 20, was assigned to ACTRON TECHNOLOGY Corp. (Taoyuan, Taiwan).
"Heat dissipation structure and power module" was invented by Hsin-Chang Tsai (Taoyuan, Taiwan) and Ching-Wen Liu (Taoyuan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation structure includes a substrate and an annular groove. The substrate has an upper surface and a lower surface opposite to each other. The annular groove is configured on the upper surface of the substrate to divide the substrate into a configuration area and a periphery area. The annular groove is located between the configuration area and the periphery area. A depth of the a...