US Patent Issued to ACM RESEARCH (SHANGHAI) on Dec. 2 for "Substrate processing method" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,486,590, issued on Dec. 2, was assigned to ACM RESEARCH (SHANGHAI) INC. (Shanghai).

"Substrate processing method" was invented by Meng Wu (Shanghai), Chenhua Lu (Shanghai), Zhaowei Jia (Shanghai), Quan Cao (Shanghai), Jian Wang (Shanghai) and Hui Wang (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a substrate processing method, which comprises the following steps: S1: transferring a substrate plated with a first metal layer from a first plating chamber to a second plating chamber; S2: after transferring the substrate to the second plating chamber, forming a water film layer on the front side of the substrate; S3: electroplating a s...