US Patent Issued to Acer on Aug. 25 for "Electronic package module" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,169, issued on Aug. 25, was assigned to Acer Inc. (New Taipei City, Taiwan).

"Electronic package module" was invented by Yu-Shih Wang (New Taipei City, Taiwan), Chih-Chun Liu (New Taipei City, Taiwan), Cheng-Nan Ling (New Taipei City, Taiwan) and Wen-Chieh Tai (New Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention provides an electronic package module including a chip, a heat-dissipation component, a carrying member, and a liquid metal. The carrying member is clamped between the chip and the heat-dissipation component. The carrying member has a porous structure. The liquid metal is filled in the porous structure to be ...