ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,513,857, issued on Dec. 30, was assigned to ACBEL POLYTECH INC. (New Taipei, Taiwan).
"Heat dissipating structure of a power supply" was invented by Chia-Hao Lin (New Taipei, Taiwan), Tse-Jung Kuo (New Taipei, Taiwan) and Min-Che Tu (New Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipating structure of a power supply is disposed on an inner side of a casing and has two heat dissipating covers configured to be connected with each other, and a heat dissipating sleeve annularly mounted on and around the two heat dissipating covers and disposed between the heat dissipating covers and the casing. The heat dissipating sleeve is abl...