US Patent Issued to Absolics on Sept. 29 for "Method of manufacturing packaging substrate and packaging substrate manufactured thereby" (South Korean, American Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,303, issued on Sept. 29, was assigned to Absolics Inc. (Covington, Ga.).

"Method of manufacturing packaging substrate and packaging substrate manufactured thereby" was invented by Tae Kyoung Kim (Covington, Ga.) and Si Hun Lee (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a method of manufacturing a packaging substrate and a packaging substrate manufactured thereby. The method of manufacturing a packaging substrate according to the present disclosure includes: generating a glass structure that is a core via, a cavity portion, or both on a glass core including a first surface and a second ...