ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,496, issued on Jan. 27, was assigned to Abbott Cardiovascular Systems Inc. (Santa Clara, Calif.).
"Mold for forming solder distal tip for guidewire" was invented by Robert C. Hayzelden (Murrieta, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A mold is used to form a solder joint to join the distal end of the guidewire to a wire coil. The mold has a cavity that can have different configurations so that the solder joint can be any of bullet shaped, micro-J shaped, cone shaped, truncated cone shaped, or have a textured surface."
The patent was filed on March 3, 2022, under Application No. 17/685,767.
*For further information, including images...