ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,765, issued on Feb. 10, was assigned to AaltoSemi Inc. (Jiangsu, China).
"Package substrate and fabricating method thereof" was invented by Min-Yao Chen (Jiangsu, China), Yin-Ju Chen (Jiangsu, China) and Andrew C. Chang (Jiangsu, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package substrate is provided, in which conductive pillars are formed on a circuit layer of a core board body, and an insulating layer encapsulates the conductive pillars in such a manner that the conductive pillars are exposed from a surface of the insulating layer for use as external contacts. Hence, there is no need to fabricate a wiring layer on the insulating layer...