ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,003, issued on April 7, was assigned to AaltoSemi Inc. (Nanjing City, China).
"Manufacturing method of package substrate" was invented by Andrew C. Chang (Nanjing City, China), Min-Yao Chen (Nanjing City, China) and Sung-Kun Lin (Nanjing City, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a package substrate is provided, the manufacturing method includes forming a first circuit layer on a first metal layer; forming a dielectric layer on the first metal layer and the first circuit layer; forming a second metal layer on the dielectric layer; forming a plurality of conductive blind vias in the dielectric layer and formi...