ALEXANDRIA, Va., March 3 -- United States Patent no. 12,565,417, issued on March 3, was assigned to AAC Technologies Pte. Ltd. (Singapore).
"MEMS device and manufacturing method thereof" was invented by Houming Chong (Johor, Malaysia), Veronica Tan (Singapore), Zaixiang Pua (Singapore), Kahkeen Lai (Singapore) and Zhan Zhan (Shenzhen, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A MEMS device and a method for manufacturing the MEMS device are provided. The MEMS device includes a cap sheet and a device sheet. The device sheet includes a silicon substrate, at least two device structure layers, and at least one conductive structure layer, and each two adjacent device structure layers are coupled via a c...