ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,107, issued on Jan. 20, was assigned to AAC Microtech (Changzhou) Co. Ltd. (Changzhou, China).
"Speaker module" was invented by Hailin Liu (Changzhou, China), Hong Li (Changzhou, China) and Wu Wang (Changzhou, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A speaker module is disclosed. The speaker module includes a shell, a speaker unit and a ring body. The speaker unit includes a frame, a magnetic circuit system, a vibration system having a diaphragm in a ring shape surrounding the ring body. The magnetic circuit system includes a yoke and a main magnetic unit. A through hole penetrates through the yoke and the main magnetic unit and is cove...