ALEXANDRIA, Va., July 21 -- United States Patent no. 12,686,614, issued on July 21, was assigned to AAC Kaitai Technologies (Wuhan) Co. LTD. (Wuhan, China).
"MEMS loudspeaker manufacturing method and MEMS loudspeaker" was invented by Qiang Dan (Wuhan, China), Rui Cai (Wuhan, China), Yiwei Zhou (Wuhan, China), Yu Shen (Wuhan, China) and Yang Li (Wuhan, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A MEMS loudspeaker manufacturing method and a MEMS loudspeaker are provided. The MEMS loudspeaker manufacturing method includes positioning a printed circuit board (PCB) substrate, inverting a MEMS chip and electrically connecting the PCB substrate to a first side of the PCB substrate having a first groove. f...