US Patent Issued to AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) on Oct. 20 for "Speaker module and smart headset" (Chinese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,771,986, issued on Oct. 20, was assigned to AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) Co. LTD. (Shenzhen, China).

"Speaker module and smart headset" was invented by Meng Lin (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A speaker module and a smart headset are provided. The speaker module includes a speaker housing, a first sounding unit, and a second sounding unit. An accommodating cavity is defined in the speaker housing, the accommodating cavity includes a first space and a second space. The first sounding unit is fixed in the accommodating cavity, the first sounding unit divides the first space into a first rear sound cavity and a first...