US Patent Issued to 3M Innovative Properties on Feb. 17 for "Electrically conductive bonding tape with low passive intermodulation" (American, South Korean Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,552,971, issued on Feb. 17, was assigned to 3M Innovative Properties Co. (St. Paul, Minn.).

"Electrically conductive bonding tape with low passive intermodulation" was invented by Jeongwan Choi (Suwon-Si, South Korea), Jeffrey W. McCutcheon (Baldwin, Wis.), Marina M. Kaplun (Woodbury, Minn.), Steven Y. Yu (St. Paul, Minn.) and Jinbae Kim (Ansan, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on t...