US Patent Issued to 3M Innovative Properties on Dec. 2 for "Polishing semiconductor wafers using causal models" (Minnesota, Wisconsin Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,487,566, issued on Dec. 2, was assigned to 3M Innovative Properties Co. (St. Paul, Minn.).

"Polishing semiconductor wafers using causal models" was invented by Brian E. Brooks (St. Paul, Minn.), Gilles J. Benoit (Minneapolis), Peter O. Olson (Andover, Minn.), Tyler W. Olson (Woodbury, Minn.), Himanshu Nayar (St. Paul, Minn.), Frederick J. Arsenault (Stillwater, Minn.), Nicholas A. Johnson (Burnsville, Minn.), Vincent J. Laraia (Houlton, Wis.) and Don V. West (St. Paul, Minn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for optimizing a process of polishin...