ALEXANDRIA, Va., July 16 -- United States Patent no. 12,667,917, issued on June 30, was assigned to 3D-Micromac AG (Chemnitz, Germany).
"Method and system of producing microstructured components" was invented by Torsten Leichsenring (Wildenfels, Germany), Kai Mittwoch (Striegistal OT Marbach, Germany), Claudia Unger (Chemnitz, Germany) and Steffen Lotzsch (Hohenstein-Ernstthal, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of producing a microstructured component includes a multiplicity of micro-functional elements on a substrate that carries an array of pixel-forming micro-light-emitting diodes on an electrical supply structure, including laser processing in at least one method stage in a ...