ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,801, issued on Sept. 9, was assigned to 3-5 Power Electronics GmbH (Dresden, Germany).
"Packaged semiconductor device" was invented by Jens Kowalsky (Storkow, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "Packaged semiconductor device having a heat sink, wherein the heat sink has a top, a bottom, lateral surfaces that connect the top to the bottom, and, extending within the heat sink, a cooling structure with an inlet line as well as an outlet line for a cooling medium, and is composed of an electrically conductive material with a first coefficient of thermal expansion at the top and with a second coefficient of thermal expansion at the bo...