US Patent Issued on Sept. 9 for "Lid allowing for a thermal interface material with fluidity in a lidded flip chip package" (California Inventor)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,803, issued on Sept. 9.

"Lid allowing for a thermal interface material with fluidity in a lidded flip chip package" was invented by Yuci Shen (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure describes a lid allowing for a thermal interface material with fluidity, like a liquid metal, in a lidded flip chip package, including: a lid, a sealing ring for forming a sealed gap between a flip chip and the lid, a storage tunnel in the lid for accepting or releasing a liquid from or to the sealed gap, a connecting hole connecting the sealed gap with the storage tunnel, an injection hole with a plug, wherein a plug structure is...