US Patent Issued on Sept. 29 for "Submounts with stud protrusions for semiconductor packages" (North Carolina Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,305, issued on Sept. 29.

"Submounts with stud protrusions for semiconductor packages" was invented by Afshin Dadvand (Durham, N.C.) and Devarajan Balaraman (Apex, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor packages are provided. In one example, a semiconductor package includes a submount. The semiconductor package further includes a semiconductor die on the submount. The submount defines a base plane, and the submount includes at least one stud protrusion extending from the base plane in a direction toward the semiconductor die."

The patent was filed on July 25, 2023, under Application No. 18/358,616.

*For further informati...