US Patent Issued on Oct. 20 for "Microelectronic test interface substrates, devices, and methods of manufacture thereof probe head test contact pin shield and dielectric insulation on top layer of buildup redistribution layer system" (California Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,768,883, issued on Oct. 20.

"Microelectronic test interface substrates, devices, and methods of manufacture thereof probe head test contact pin shield and dielectric insulation on top layer of buildup redistribution layer system" was invented by Raymond Won Bae (Danville, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment of the present invention provides a method and system of manufacturing a redistribution platform comprising and providing a base substrate; buildup layer level thereof vertical electrical shield and insulation on the top layer test pad to provide EMI protection from probe contact pins and another adjacent conductor." ...