ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,475, issued on Oct. 20.
"High-temperature-high-pressure processing unit by solvent application of pressure" was invented by Ryutaro Wada (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "To provide a hydrostatic pressure type high temperature and high-pressure treatment apparatus by a wet method and a dry method for efficiently mass-producing high-quality and large-sized synthetic diamond. In the treatment apparatus, a high-pressure cell prevented from the intrusion of a pressure medium into the inside is housed in a high-pressure container, and hydrostatic pressurization is performed by the liquid pressure medium. At least one pressurizing mech...