US Patent Issued on Oct. 14 for "Semiconductor assemblies with hybrid fanouts and associated methods and systems" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,713, issued on Oct. 14.

"Semiconductor assemblies with hybrid fanouts and associated methods and systems" was invented by Bharat Bhushan (Taichung, Taiwan), Pratap Murali (Meridian, Idaho) and Raj K. Bansal (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Hybrid fanouts for semiconductor device assemblies, and associated methods and systems are disclosed. In one embodiment, at least one edge a first semiconductor die is attached to a molding including through mold vias (TMVs). Conductive traces may be formed on a first side of the first semiconductor die, where the first side includes integrated circuitry coupled to the conductive traces...