US Patent Issued on Nov. 3 for "Semiconductor package structure having thermal management structure" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,775, issued on Nov. 3.

"Semiconductor package structure having thermal management structure" was invented by Chun-Ming Lin (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a package structure. The package structure includes: a first die, a second die arranged over the first die, an under-bump metallization (UBM) layer covering a back surface of the second die and a side surface of the first die (1712); and a first through via extending through the first die and the second die, wherein a top of the first through via is coupled to the UBM layer."

The patent was filed on Feb. 9, 2026, under Applicat...