US Patent Issued on May 5 for "Digitalizable and returnable packaging structure for various modular items" (New York Inventor)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,617,580, issued on May 5.

"Digitalizable and returnable packaging structure for various modular items" was invented by Duyuan Yu (Monticello, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "This invention presents a digitalizable, returnable packaging structure for a range of modular items, such as photovoltaic modules, combining environmental sustainability with advanced technology. Central to this design is a pallet featuring equidistantly spaced and concavely shaped support legs with reinforcement grooves for stability. These legs also have electronic labels (RFID, barcode, QR code) for efficient tracking. Stacked on top of the pallet is a packagin...