US Patent Issued on May 5 for "Circuit board structure with shielding and heat dissipation functions, and manufacturing method therefor" (Taiwanese Inventor)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,621,938, issued on May 5.

"Circuit board structure with shielding and heat dissipation functions, and manufacturing method therefor" was invented by Hsien-Chiang Su (Keelung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a circuit board structure and manufacturing method thereof. Select a processing area for electronic components on a circuit board containing a copper foil layer, and calculate marking points without setting the electronic components. Spray water-based environmentally friendly paint on the circuit board to form a first insulating layer. Cut the circuit board outside the marking points to form thr...