ALEXANDRIA, Va., June 12 -- United States Patent no. D1,074,331, issued on May 13.

"Baking mold" was invented by Yung Wen Chen (New Taipei, Taiwan).

The patent was filed on April 10, 2023, under Application No. D/873,615.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1074331&OS=D1074331&RS=D1074331

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