ALEXANDRIA, Va., May 12 -- United States Patent no. D1,126,264, issued on May 12.
"Heat curing board" was invented by Hua Liao (Shenzhen, China) and Ting Xiang (Shenzhen, China).
The patent was filed on May 9, 2024, under Application No. D/941,435.
*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1126264&OS=D1126264&RS=D1126264
Disclaimer: Curated by HT Syndication....