US Patent Issued on March 31 for "Electronic package and method for making the same" (South Korean Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,397, issued on March 31.

"Electronic package and method for making the same" was invented by SeungHyun Lee (Incheon, South Korea), HeeSoo Lee (Incheon, South Korea) and YeJin Park (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package comprises: a substrate comprising a first region and a second region adjacent to the first region in a lengthwise direction of the substrate; a first electronic component mounted on the substrate in the first region; a second electronic component mounted on the substrate in the second region, wherein the second electronic component does not occupy an entirety of the substrate in a w...