ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,576, issued on March 3.
"Stud bumped printed circuit assembly" was invented by James Rathburn (Rogers, Minn.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board having a plurality of conductive layers including a first conductive layer and a second conductive layer is provided. The circuit board includes a plurality of non-conductive layers in-between respective conductive layers of the plurality of conductive layers. The plurality of non-conductive layers include at least a first non-conductive layer disposed between the first conductive layer and the second conductive layer. At least one collapsed stud bump extends at least partially th...