US Patent Issued on March 24 for "Wire embedded label on special substrate with or without inductive coupling" (Indian Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,585,909, issued on March 24.

"Wire embedded label on special substrate with or without inductive coupling" was invented by Puneet Kapoor (Noida, India) and Alok Kapoor (Ghaziabad, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "In accordance with the embodiments of this disclosure, an RFID label or tag (201, 202, 203, 204) is disclosed. The RFID label or tag (201, 202, 203, 204) includes one or more layers of substrate (1), one or more integrated circuits (2), and one or more antennas (3,3A). Herein, the one or more integrated circuits (2) and the one or more antennas (3,3A) are embedded on the one or more layers of substrate (1)."

The patent was...