ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,906, issued on March 17.
"Method for bonding and debonding substrates" was invented by Erich Thallner (St. Florian am Inn, Austria).
According to the abstract* released by the U.S. Patent & Trademark Office: "The invention relates to a method for the temporary bonding of a product substrate with a carrier substrate and for the debonding of a product substrate from a carrier substrate, corresponding devices and a substrate stack."
The patent was filed on May 29, 2020, under Application No. 17/920,854.
*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-boo...