US Patent Issued on March 17 for "Film for temporary fixation, layered product for temporary fixation, and method for producing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,907, issued on March 17.

"Film for temporary fixation, layered product for temporary fixation, and method for producing semiconductor device" was invented by Yasuyuki Oyama (Tokyo), Emi Miyazawa (Tokyo), Yuta Akasu (Tokyo) and Shogo Sobue (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A film for temporary fixing used for temporarily fixing a semiconductor member and a support member contains a curable resin component. The storage modulus at 270deg C. after curing of the film for temporary fixing is 1.5 to 20 MPa. The storage modulus at 25deg C. after curing of the film for temporary fixing is 1.5 to 150 MPa."

The patent was filed on Sept. 2...