ALEXANDRIA, Va., July 16 -- United States Patent no. 12,671,387, issued on June 30.
"Surface acoustic wave device" was invented by Michio Kadota (Sendai, Japan), Shuji Tanaka (Sendai, Japan) and Hiroyuki Nakamura (Kadoma, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Surface acoustic wave device for providing resonance of a surface acoustic wave having a wavelength Lambda can include a substrate and a piezoelectric layer implemented over the substrate to have a thickness greater than 2Lambda. The surface acoustic wave device can further include an interdigital transducer electrode formed over the piezoelectric layer to have mass density and thickness selected to provide a tuned mass-loading property f...