ALEXANDRIA, Va., July 16 -- United States Patent no. 12,667,980, issued on June 30.
"Layer module for handling robot system" was invented by Martin Zimmer (Rheinau, Germany) and Gunther Zimmer (Rheinau, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A layer module for integration into a handling robot system has an interface bank on the robot side, an interface bank on the handling side, and a third interface bank. The interface bank on the robot side has a geometric connection contour for position-centered fastening to an industrial robot of the robotic handling system or to a robot adapter part, along with a cable feed for receiving a fixed wiring of an electrical functional assembly arranged in th...