ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,639, issued on June 3.
"Hybrid bond method for fixing dies" was invented by Yen Hao Lu (Zhubei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A hybrid die bonding method includes the following steps: dicing a wafer into a plurality of dies arranged on a plurality of target blocks of a carrier film, wherein surfaces of each of the dies have no solder and bump; cleaning particulate from first surfaces of the dies; separating side portions and corner portions of second surfaces of the dies from the target blocks; turning the carrier film and transferring the dies to a first carrier, wherein the first surfaces of the dies contact the first carrie...